Physische Intelligenz
Article
2022
Enhanced Flexible Mold Lifetime for Roll-to-Roll Scaled-Up Manufacturing of Adhesive Complex Microstructures
Physische Intelligenz
Jaekang Kim
Postdoctoral Researcher
Physische Intelligenz
Nagaraj Krishna-Subbaiah
Physische Intelligenz
Yingdan Wu
Postdoctoral Researcher
Physische Intelligenz
Jongkuk Ko
Physische Intelligenz
Anitha Shiva
Research Technician
Physische Intelligenz
Metin Sitti
Guest Researcher
| Author(s): | Kim, Jae-Kang and Krishna-Subbaiah, Nagaraj and Wu, Yingdan and Ko, Jongkuk and Shiva, Anitha and Sitti, Metin |
| Journal: | Advanced Materials |
| Volume: | 35 |
| Number (issue): | 2 |
| Year: | 2022 |
| Publisher: | Wiley Online Library |
| Bibtex Type: | Article (article) |
| DOI: | 10.1002/adma.202207257 |
| State: | Published |
| Article Number: | 2207257 |
| Digital: | True |
| Electronic Archiving: | grant_archive |
BibTex
@article{kimenhanced,
title = {Enhanced Flexible Mold Lifetime for Roll-to-Roll Scaled-Up Manufacturing of Adhesive Complex Microstructures},
journal = {Advanced Materials},
volume = {35},
number = {2},
publisher = {Wiley Online Library},
year = {2022},
slug = {kimenhanced},
author = {Kim, Jae-Kang and Krishna-Subbaiah, Nagaraj and Wu, Yingdan and Ko, Jongkuk and Shiva, Anitha and Sitti, Metin}
}