@inproceedings{escidoc:0800,
  title = {{Investigation of Electromigration in Copper Interconnects by Noise Measurements}},
  booktitle = {{Noise as a Tool for Studying Materials}},
  pages = {271--281},
  series = {{Proceedings of SPIE}},
  address = {Santa Fe, New Mexico},
  year = {2003},
  slug = {escidoc-0800},
  author = {Emelianov, V. and Ganesan, G. and Puzic, A. and Schulz, S. and Eizenberg, M. and Habermeier, H.-U. and Stoll, H.}
}