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Physische Intelligenz Article 2008

Modeling the soft backing layer thickness effect on adhesion of elastic microfiber arrays

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Physische Intelligenz
Metin Sitti
Guest Researcher

Author(s): Long, Rong and Hui, Chung-Yuen and Kim, Seok and Sitti, Metin
Journal: Journal of Applied Physics
Volume: 104
Number (issue): 4
Pages: 044301
Year: 2008
Publisher: AIP
Bibtex Type: Article (article)
Electronic Archiving: grant_archive

BibTex 

@article{long2008modeling,
  title = {Modeling the soft backing layer thickness effect on adhesion of elastic microfiber arrays},
  journal = {Journal of Applied Physics},
  volume = {104},
  number = {4},
  pages = {044301},
  publisher = {AIP},
  year = {2008},
  slug = {long2008modeling},
  author = {Long, Rong and Hui, Chung-Yuen and Kim, Seok and Sitti, Metin}
}